This is a mid-activated flux of high quality and purity for precise soldering. It moistens and cleans soldered surface perfectly, protecting it from oxidation. recommended for BGA elements mounting dedicated for SMD does not require cleaning – NO CLEAN prevents dry joints forming protects soldered surface from oxidation

This cooling agent is non-flammable, chemically pure and non-toxic. It is used for thermal fault location. Provides an instant solution by cooling circuitry down to -65°C. It best locates dry joints and damaged electronic components like integrated circuits, diodes, etc. It is helpful in fitting bearings and bushings as well as in dismantling clenched metal parts. USE for testing: electronic parts and subassemblies thermostats in refrigeration equipment thermocontrol systems electronic elements of carburetors ignition systems